Soft and hard board opening & splitting

Machinable product thickness: T<1.2MM;
Machinable format: 500*1500MM;
Accuracy: +-0.02MM;
Description: There is no stress on the split plate and no carbonization on the cutting edge.

Laser direct removal of copper circuit forming

Aperture: minimum line distance 0.05MM;
Accuracy: +-0.002M M;
Description: Smooth edges and no carbonization.

Sapphire internal carving

Glass carving

Dial engraving

Fingerprint chip cutting

Machinable product thickness: T<1.2MM;
Accuracy: +-0.02MM;
Description: The cutting edge has no burnt edges, no discoloration, no carbonization, and no chipping.

Ferrite cutting

Machinable format: 500* 1500MM ;
Accuracy: +-0.02MM ;
Description: No carbonization on the cutting edge.

Sony glue & conductive glue cutting

Machinable format: 500*1500MM;
Accuracy: +-0.02MM ;
Description: The cutting edge basically has no thermal effect.

Tin sheet laser forming

Machinable product thickness: T<0.2MM;.
Machinable format: 600*600MM;
Accuracy: +-0.01MM;
Description: The cutting edge has no carbonization and no burrs.

Vertical pin drilling

Machinable product thickness: T<0.2MM;
Machinable format: 600*600MM;
Accuracy: +-0.01MM;
Description: The cutting edge has no carbonization and no burrs.