Soft and hard board opening & splitting

Machinable product thickness: T<1.2MM;
Machinable format: 500*1500MM;
Accuracy: +-0.02MM;
Description: There is no stress on the split plate and no carbonization on the cutting edge.

Laser direct removal of copper circuit forming

Aperture: minimum line distance 0.05MM;
Accuracy: +-0.002M M;
Description: Smooth edges and no carbonization.

Substrate drilling

Aperture: minimum aperture 0.05MM;
Accuracy: size +-0.001MM, position accuracy +-0.01MM;
Description: The hole wall is smooth, without burrs.

PCB sub-board

Processable product thickness: T<1.2MM;
Machinable format: 500* 1500MM ;
Accuracy: +-0.02MM ;
Description: There is no stress on the split plate and no carbonization on the cutting edge.

FPC sub-board

Processable product thickness: T<1.2MM;
Machinable format: 500*1500MM;
Accuracy: +-0.02MM
Description: Precise positioning, no carbonization, no misalignment and no burrs on the cutting edge.